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Unisem, a global provider of semiconductor assembly and test services, today announced the addition of a Teradyne FLEX test system to its US-based test development center located in Sunnyvale, CA. The addition of the FLEX test system will further expand Unisem’s existing testing capabilities in the mixed signal and RF spaces.
The FLEX system has been the gold standard for analog-dominant SOC testing for over a decade. With over 2,300 systems installed worldwide, FLEX has been proven for a broad range of applications. Teradyne’s IG-XL software, used on all FLEX, J750 and UltraFLEX platforms, also enables faster test program development with higher quality code and shorter tester times. IG-XL has consistently been rated the #1 ATE software by customers in independent surveys.
“The FLEX test system exemplifies our commitment to innovation, as exhibited through the shift from our previous legacy products, to our new suite of product offerings,” said Marita Erickson, General Manager of Unisem Sunnyvale. “We are excited to serve an even broader market segment and look forward to continually working with our Asia based factories on high volume production to support our customers.”
“Facilitating the growth of emerging semiconductor companies is key to our mission,” said Jim Mahon, VP, Global Services, Teradyne. "Expanding the partnership between Teradyne’s Global Service Organization and Unisem through their test development centers will continue to establish both companies as leaders in this effort.”
Unisem is a global provider of semiconductor assembly and test (OSAT) services for many of the world's most successful electronics companies. We offer an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of leadframe and substrate IC packaging; wafer level CSP; and RF,analog, digital, and mixed signal test. Our turnkey services include design, assembly, test, failure analysis, and electrical, mechanical, and thermal characterization and modeling. Unisem is an established MEMS OSAT with several years of experience in volume consumer and automotive production, in addition to a broad package portfolio covering multiple applications. The company has factory locations in Ipoh, Malaysia; Chengdu, People's Republic of China; Batam, Indonesia; and Sunnyvale, USA. Unisem is headquartered in Kuala Lumpur, Malaysia.