Viasystems Group, Inc. (NASDAQ:VIAS) received the 2014 Printed Circuit Boards and Electro-Mechanical Solutions Build to Print Supplier of the Year Award at the Rockwell Collins Annual Supplier Conference.
The Supplier of the Year award is an acknowledgement of significant contributions made during the year by suppliers and is based upon quality, delivery, total cost of ownership, lead time and customer service. “We are truly honored and excited to have received this award for the second consecutive year as it demonstrates our commitment to quality and outstanding service in serving our customers in the military/aerospace end market,” stated Viasystems’ CEO David M. Sindelar.
Viasystems Group, Inc. is a technology leader and a worldwide provider of complex multi-layer printed circuit boards (PCBs) and electro-mechanical solutions (E-M Solutions). Its PCBs serve as the “electronic backbone” of almost all electronic equipment, and its E-M Solutions products and services include integration of PCBs and other components into finished or semi-finished electronic equipment, for which it also provides custom and standard metal enclosures, cabinets, racks and sub-racks, backplanes and busbars. Viasystems’ approximately 15,100 employees around the world serve over 1,000 customers in the automotive, industrial & instrumentation, computer and datacommunications, telecommunications, and military and aerospace end markets. For additional information about Viasystems, please visit the company’s website at
About Rockwell Collins
Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications. Our expertise in flight deck avionics, cabin electronics, mission communications, information management, and simulation and training is delivered by a global workforce, and a service and support network that crosses more than 150 countries. To find out more, please visit