- The ACS Pro TM, first launched at SEMICON Taiwan in Sept of 2013, is the best fit for ultra-fine pitch and advanced copper wire bonding applications with a bond pad pitch range of 40-69 microns.
- The new ACS Max TM is targeted for advanced package carrier families, such as mid-pin count QFP, QFN, PPF, uPPF and leadframes with a bond pad pitch range of 70-120 microns.
- The new ACS Lite TM is targeted for low-pin count applications, such as discrete & powered integrated circuit applications using large wire diameters and a bond pad pitch in excess of 120 microns.
Kulicke & Soffa Expands The Advanced Copper Solution (ACS) Series Capillaries – Introduces ACS MaxTM And ACS LiteTM
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