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Airspan Networks Selects Texas Instruments' KeyStone™ SoCs For Next-generation Small Cell Backhaul Platforms

BARCELONA, Spain, Feb. 24, 2014 /PRNewswire/ -- MOBILE WORLD CONGRESS -- Texas Instruments (TI) (NASDAQ: TXN) and Airspan Networks Inc., a global provider of 4G broadband wireless systems and solutions, announced a new collaboration –  Airspan's Small Cell LTE solution, AirSynergy.  With TI's KeyStone TM-based wireless infrastructure System-on-Chips (SoCs), Airspan is able to leverage their software investment and enhance functionality and performance of their LTE small cell with a range of integrated wireless backhaul options including support for both LTE relay and hybrid non-line-of-sight (NLOS) connectivity. TI's KeyStone technology enables Airspan to deliver a small cell product which is significantly differentiated from their competition.

"We are confident that adopting TI's wireless infrastructure solutions is a game changer for Small Cell LTE deployments," said Paul Senior, CTO, Airspan. "The integration of wireless backhaul with the outdoor pico eNB dramatically reduces overall small cell TCO. By leveraging the advanced features that the platform can support ensures consistent quality of experience as a user moves between macro and pico RAN layers."

Leveraging TI's platform for its next generation of small cell backhaul products, Airspan offers a highly flexible Software Defined Radio (SDR) platform enabling multi-mode operation including LTE relay and complementary alternative wireless backhaul options. Starting with 3GPP Release 10, Airspan's AirSynergy solution has a roadmap to LTE-Advanced with capacity enhancing features such as carrier aggregation. With options for tight integration with outdoor pico cell eNB, TI's KeyStone-based solution forms the heart of Airspan's Software Defined Networking (SDN) solution for small cell backhaul over multiple wireless and wireline technologies.

TI's wireless infrastructure SoCs leverage the fastest dual ARM® Cortex® -A15 RISC processors and TI's fixed- and floating-point TMS320C66x digital signal processor (DSP) generation cores as part of TI's highly efficient KeyStone SoC architecture. Additionally TI's broad resources bring the most comprehensive portfolio of processing, software and complementary support devices to Airspan. TI also offers a complimentary portfolio of analog components, including the AFE7500 analog front end (AFE) transceiver, clock and timer, and Power over Ethernet (PoE+) solutions for both ends of the cable. This places TI in a unique position in the industry to meet small cell backhaul challenges at a system level.

"We are excited to be collaborating with Airspan on their next-generation AirSynergy small cell solution," said Ruwanga Dassanayake, worldwide business manager, communications infrastructure, TI. "Airspan is generating buzz in this fast growing market with their integrated outdoor pico small cell and backhaul approach, and we look forward to seeing their small cell solution deployed in the field quickly."

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