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FREMONT, Calif., Dec. 9, 2013 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a leading supplier of semiconductor test and burn-in equipment, today announced it has received over $1 million in a follow-on order for its FOX-15 wafer-level burn-in and test system and WaferPak full-wafer contactors from a leading supplier of automotive and industrial integrated circuits.
The FOX-15 system will be used in production and has a capacity of up to 15 WaferPak single-touchdown full-wafer contactors for production burn-in and test of state-of-the-art integrated circuits. As each wafer contains thousands of ICs, the throughput and capacity of the system are quite large, adding to the millions of devices that have already been processed by the FOX-15 systems at this customer's facility.
"Doing burn-in at the wafer level, before the die are packaged, allows our customers to collect reliability data much earlier in their production process so that they can monitor and continuously improve their wafer fabrication process and yields," said Carl Buck, vice president of marketing at Aehr Test Systems. "We are pleased to see that our automotive customers are increasing capacity, an indication both of their success and the strength that we are seeing in the automotive market."
"We continue to feel that our intellectual property and products that address functional test, burn-in, cycling, process development and process monitoring at the wafer level are key differentiators for our company and for our customers that use them," said Gayn Erickson, president and chief executive officer of Aehr Test Systems. "We are pleased that one of our key customers continues to see significant improvement in cost of test and cost of manufacturing by their implementation of wafer level test and burn-in in production. This is achieved not only through an overall lower capital cost through massive parallel test solutions, but also by finding device defects prior to packaging, allowing our customers to deliver a highly reliable product without the significant cost of finding those defects after the device, or in the case of stacked packages, multiple devices are in final package form."