Dec. 3, 2013
/PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS) today announced the introduction of the Purion H next generation, single wafer high current implanter, the third member of its innovative Purion platform. With the addition of the Purion H, the Purion Platform now provides chipmakers with a full common platform of the industry's most advanced implant solutions to optimize device performance and enable high yield manufacture of sub 16nm planar and 3-D devices.
The Purion H ushers in a revolutionary new era of high performing implant technology, elevating what customers will come to expect from high current implanters. A few of its many new and innovative features include:
- Next generation scanned spot beam technology with precision implant angle and dose control to enhance device performance and yield.
- Enabling process control technology to minimize all forms of contaminants to ensure absolute beam purity.
- Common Purion cross-platform architecture designed to drive manufacturing flexibility and lower the total cost of fab operations.
, executive vice president of product development, engineering and marketing said, "The Purion H is a modern high current implanter that incorporates enhanced spot beam technology, and is designed to provide customers with an unprecedented level of process flexibility to support the manufacturing challenges of the industry's next generation devices, planar or three dimensional. Due to its unique design, its enabling process control, and Purion platform commonality, we expect the Purion H will become the industry standard in high current, single wafer implant."
The Purion Platform
The Purion platform is redefining implanter technology and performance, with each product setting a new benchmark in its respective market. The powerful common platform enables the efficient production of all existing and emerging implant applications across the medium current, high current and high energy space. The scanned spot beam architecture used on all Purion products assures that customers can take full advantage of all current and future advanced process enabling implants, including materials modification techniques required in leading edge device processes. All Purion implanters incorporate Axcelis' industry leading contamination defense system, for unsurpassed implant quality, so even the most sensitive devices can realize optimized device performance. The common platform's proprietary dose and angle control system, and constant focal length scanning deliver the most precise and repeatable dopant placement available today. The Purion platform includes the Purion M
medium current implanter, the Purion H
high current implanter, and the Purion XE
high energy implanter.
Safe Harbor Statement
This press release contains forward-looking statements under the SEC safe harbor provisions. These statements, which include our expectations for market acceptance of our Purion H ion implanter, are based on management's current expectations and should be viewed with caution. They are subject to various risks and uncertainties, many of which are outside the control of the Company, including the timing of orders and shipments, the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with and purchases by major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic, political and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other documents filed from time to time with the Securities and Exchange Commission.
Axcelis (Nasdaq: ACLS), headquartered in
, has been providing innovative, high-productivity solutions for the semiconductor industry for over 35 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and
complete life cycle support
systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at