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Advantest Corporation (TSE: 6857, NYSE: ATE) today announced that it has logged its first three orders for its new EB (electron beam) lithography system, the F7000, from the University of Tokyo, the University of Kyoto, and a semiconductor industry customer. The systems will be shipped within the fiscal year ending March 2014.
The F7000 Series utilizes electron beams to write fine-pitch patterns directly onto substrates. It offers best in class levels of throughput at the 1Xnm node, where semiconductor R&D demand is now focused. The system’s self-cleaning function ensures stable performance over long periods, while the adjuster function enables support for substrates of diverse sizes, shapes, and materials.
The customers who have ordered the F7000 Series at this time plan to use the system for R&D in the fields of MEMS/NEMS(non-electro-mechanical systems), biochips, new devices, and electronic components, in addition to research into semiconductor wafers and other forms and types of substrate. The orders mark a milestone in Advantest’s strategic expansion into new markets where its cutting-edge EB microfabrication technologies can contribute to further advances in next-generation device research and development.
About Advantest Corporation
A world-class technology company, Advantest is the leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments used in the design and production of electronic instruments and systems. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies, and has recently introduced multi-vision metrology scanning electron microscopes essential to photomask manufacturing, as well as a groundbreaking 3D imaging and analysis tool. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide. More information is available at
All information supplied in this release is correct at the time of publication, but may be subject to change.