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Entropic Discusses Advantages Of Next-Generation Silicon Platforms For The Connected Home

SAN DIEGO, Sept. 30, 2013 (GLOBE NEWSWIRE) -- Entropic (Nasdaq:ENTR), a world leader in semiconductor solutions for the connected home, today announced its participation in two upcoming events this week – the 2013 Fiber to the Home (FTTH) Conference & Expo and the IEEE Communications Society/Consumer Electronics Society Event: The TV Screen in the Home.

Michail Tsatsanis, Ph.D, Entropic's director of Communication Systems and an IEEE Fellow will be presenting at two industry events this week about how next-generation silicon platforms will advance the Connected Home. At the FTTH Conference, Dr. Tsatsanis will address how new power and energy-saving techniques are being embedded into advanced silicon solutions to meet aggressive energy efficiency requirements for set-top boxes and other connected consumer electronics (CE) devices. At the IEEE event, Dr. Tsatsanis will discuss how MSOs are leveraging silicon platforms to enhance the overall TV experience with advanced features and improved in-home connectivity.

"The Connected Home silicon market is both dynamic and exciting as the innovation cycle to deliver new hardware is rapid and constant," said Dr. Tsatsanis. "At this week's conferences, we will discuss how semiconductor solutions are advancing the current state of experiential TV – from adding more power-efficient features into set-top boxes to increasing the velocity at which new applications and services are being deployed."

Entropic's Role at the Upcoming Events:

At the 2013 FTTH Conference & Expo, Dr. Tsatsanis will present, " Energy Consumption and the Connected Home," and provide an overview of the low power features supported by the Multimedia over Coax Alliance (MoCA ®) 2.0 specifications and their impact on energy consumption across connected CE devices.
Location: Tampa Convention Center – Tampa, Florida
Session Title: Energy Consumption and the Connected Home
Session #: 62
Track: New & Complementary Technology
Date/Time: October 01, 2013, 3:30 PM - 04:15 PM ET

At the IEEE Communications Society/Consumer Electronics Society Event: The TV Screen in the Home, Dr. Tsatsanis will present, " Silicon Innovations for the Next-Gen Cable Architecture," where he will review innovations in set-top box system-on-a-chip technologies as well as home and cable access networking technologies that are best poised to support next-generation cable architectures.
Location: Locatelli Center at Santa Clara University – Santa Clara, California
Session Title: Silicon Innovations for the Next-Gen Cable Architectures
Session #: 1
Track: Connectivity
Date/Time: October 05, 2013, 10:15 AM - 10:45 AM PT

For more information about either event, or to receive a copy of Dr. Tsatsanis' presentations, please contact:

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