This account is pending registration confirmation. Please click on the link within the confirmation email previously sent you to complete registration. Need a new registration confirmation email? Click here
TowerJazz, the global specialty foundry leader, and DMB Technology (DMBT), a leader of total power management solutions based on innovative analog/mixed-signal power management integrated circuits, today announced volume production and shipping of DMBT’s AC direct LED (light-emitting diode) driver IC using TowerJazz’s groundbreaking 700V BCD (Bipolar-CMOS-DMOS) power management process. AC direct LED driver ICs replace AC-DC converters or SMPS (switched-mode power supply) and controls power without the use of large capacitors and inductors over a range of AC input voltages. This enables a constant current IC for supplying current to a load regardless of input voltage variation.
The rise of LED technology is affecting every part of the commercial lighting industry. The demand for affordability and improved quality are driving the widespread adoption of LEDs, and this single technology appears likely to surpass all others in nearly every metric of quality and efficiency. According to a 2013 report from Navigant Research, worldwide unit shipments of LED lamps will grow from 68 million in 2013 to 1.28 billion annually by 2021. The markets for every other lighting technology will contract over that period. According to Jesse Foote, research analyst, “LED lighting has already begun to enter the commercial market in significant volume, and will grow rapidly over the remainder of the decade.”
TowerJazz’s 700V BCD process provides a specialized device and design environment that is especially suited to LED lighting but also applicable to AC to DC converters as well as gate drivers for MOSFETs and IGBTs in applications such as electrical motors. This technology combines 6.5V, 16V and 26V CMOS for digital, analog and gate control blocks with 700V JFET, 450V and 700V NLDMOS for robust handling of 110v and 220V AC directly while maintaining a very low total layer-count and very good Rdson resulting in products with high performance and small die size.