SAN JOSE, Calif.
Sept. 19, 2013
/PRNewswire/ -- Oclaro, Inc.
(NASDAQ: OCLR), a leading provider and innovator of optical communications solutions, today announced that it has started volume production of its next generation tunable laser platform. This new narrow linewidth micro-iTLA (Integrable Tunable Laser Assembly) is specifically targeted for coherent systems, where a high performance laser is needed for both the transmission and the local oscillator laser. The Oclaro micro-iTLA features high optical output power and off-grid tuning suitable for applications in 100G and next generation 200G coherent networks based on the PM-QPSK and 16-QAM modulation formats. Oclaro will be meeting with customers at ECOC, the largest European optical communications event from
September 23-25, 2013
meeting room MR3.
"100G coherent shipments are increasing dramatically, and we expect that shipments in 2014 will be above 40,000 ports," said
, Practice Leader for Components at Ovum Ltd. "Each of these coherent ports will require one or two narrow linewidth lasers, and we're excited to see component manufacturers such as Oclaro support the growth of 100G by introducing and ramping production of components such as this narrow linewidth micro-iTLA."
"We are pleased to have successfully completed qualification, and are actively engaged with multiple customers and have completed several design-wins with our new tunable laser platform," said
, VP of Transmission Product Management at Oclaro. "With this product offering, Oclaro is simplifying the migration to coherent at both the line card and module level, and the technology is also enabling next generation 100G and 200G pluggable form factors."
The Oclaro micro-iTLA is compliant to the OIF Multi-Source Agreement, and incorporates a form factor which is 3x smaller than the standard iTLA and has a significantly reduced power consumption, both of which enable further size reductions in coherent modules to be supported while reducing thermal concerns. The ultra-high optical power output, combined with power and frequency fine tuning, gives greater flexibility to network designers. The proven reliability of the Indium Phosphide chip technology and packaging allows customers to be confident that they are manufacturing high reliability systems.