TE Connectivity, a world leader in connectivity, has joined the Terabit Optical Ethernet Center (TOEC) research center at the University of California, Santa Barbara (UCSB) as its newest affiliate member. The company joins other industry affiliates Google Inc., Verizon, Intel, Agilent Technologies and Rockwell Collins Inc. TOEC is working on developing the technology necessary for a new generation of Ethernet that is a thousand times faster, and much more energy efficient, than today’s most advanced networks. They are aiming for 1 Terabit Ethernet over optical fiber—1 trillion bits per second—by 2015, with the ultimate goal of enabling 100 Terabit Ethernet by 2020.
“TE Connectivity is recognized for its innovation in creating fiber networks across the globe,” says Daniel Blumenthal, Professor of Electrical and Computer Engineering at UCSB and Director of TOEC, which is part of UCSB’s Institute for Energy Efficiency (IEE). “We’re pleased that they have joined our board and are working with us to make 1 Terabit Ethernet over optical fiber a reality.”
“The dramatic rise in data storage and processing is placing increasing demands on computing architectures and the reduction in latency for data transport around them,” says Rob Shaddock, Executive Vice President, Chief Technology Officer, TE Connectivity. “Terabit Ethernet is a vital component for next generation data systems. The integration of optical processing, digital processing and connectivity that is required to make Terabit Ethernet a reality will have application in many of the markets that we serve.”
Blumenthal adds, “As the boom in cloud computing exponentially increases the amount of data being transferred and stored, and consumers continue streaming videos and sharing high-resolution photos, we will need to develop much faster networking to keep up. That’s what we’re working on.”“Being affiliated with TOEC gives TE the opportunity to further shape the future technological development and formation of standards around Terabit per second -- and faster -- solutions for data centers, super computers, and telecommunications networks,” says Bill Weeks, Technology Fellow, Product Engineering and Development, TE Connectivity. “Plus, our participation gives us access to world-class research in nanophotonics.”
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