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FREMONT, Calif., Sept. 9, 2013 (GLOBE NEWSWIRE) --
Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced at the International Test Conference (ITC) that it has received $2 million in production orders for its burn-in and test systems from a leading manufacturer of advanced logic integrated circuits (ICs) for automotive, embedded processing, digital signal processing and analog applications. The orders include down payments to lock in delivery slots and volume pricing discounts. Shipments of these systems are scheduled to be completed by the third quarter of Aehr Test's fiscal 2014.
The orders are for multiple Advanced Burn-in and Test Systems (ABTS
TM) and Engineering Workstations. Two configurations of the ABTS system were ordered. The first configuration features a low-cost high-volume configuration targeted at production test and burn-in of lower-power devices, and offers compatibility with the customer's extensive inventory of burn-inboards for our previous MAX™ family of test and burn-in systems. The second configuration features individual device temperature control for improved thermal control of higher-power devices, which is needed for sophisticated processors fabricated with state-of-the-art processes.
"We are pleased to receive these orders for additional production test and burn-in systems, as it is an indication of our customer's success in the growing market for automotive and embedded applications," said Carl Buck, vice president of marketing at Aehr Test Systems. "The Engineering Workstations will give the customer's engineers the ability to develop programs efficiently and cost-effectively in their engineering labs at several development locations."
Aehr is showcasing its latest solutions for highly parallel testing of devices that incorporate Design-for-Test (DFT) or Built-In Self-Test (BIST) capabilities at ITC in Anaheim, CA. The exhibits are open Tuesday through Thursday, September 10-12.
The Aehr Test solutions all have the capability to test a large number of devices in parallel in a single system. Combined with devices which utilize BIST or DFT, they show their greatest benefit when test times are long, which is common in today's memories and processors. The ABTS system performs highly parallel testing of packaged parts. The FOX
TM-1 system performs sort testing of all the devices on a wafer in a single touchdown. The FOX-15 system combines these concepts and can perform wafer sort testing, flash cycling, or wafer-level burn-in on 15 wafers in a single load, dramatically decreasing the number of testers that would normally be required for these functions.
The ABTS family of packaged-part test and burn-in systems features a new tester-per-pin hardware and software architecture. It can test and burn-in both logic and memory devices, including resources for high pin-count devices and configurations for higher-power and lower-power applications. The ABTS system can be configured with up to 72 burn-in boards with up to 320 I/O channels each and 32M of test vector memory per channel. The ABTS system is optimized for use with the Sensata iSocket* Thermal Management Technology, which provides a scalable cost-effective solution using individual device temperature control for ICs up to 75 watts or more.