Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) ("K&S") today announced the launch of its new ACS Pro TM Capillary, for advanced copper wire bonding applications.
The new ACS Pro TM Capillary provides excellent bond-ability control with fine wire diameters. Using advanced material development and an innovative design, the quality and strength of both the 1 st (Intermetallic Coverage) and 2 nd bond are maintained over the capillary’s usable life.
The ACS Pro TM Capillary significantly improves design dynamics, and extends the copper process window with enhancement of process portability and response consistency. The consistent performance of the capillary eases the production fan-out process. The improved wear resistance material used for the new ACS Pro TM Capillary also enhances workability to help drive productivity.
Nelson Wong, Kulicke & Soffa’s Vice President, Wire Bond Solutions Business Unit, remarked, “Kulicke & Soffa continues to leverage its strong R&D process knowledge and extensive experience in delivering copper capillaries. With ACS Pro TM, customers will benefit from the excellent bond-ability control, consistent performance, while also lowering their cost of ownership. The ACS Pro TM is designed to improve copper bond quality and process stability enabling process portability and response uniformity.”The ACS Pro TM Capillary will debut at the Semicon Taiwan show at the Taipei World Trade Center Nangang Exhibition Hall from September 4-6, 2013. About Kulicke & Soffa Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. ( www.kns.com)