, a Digital Television (DTV) demodulator IC maker, and United Microelectronics Corporation (NYSE:UMC)(TWSE:2303) (“UMC”), a leading global semiconductor foundry, today announced the release of AltoBeam’s DVB-T2/T/C/S2/S demodulator to target DTV markets that have adopted these standards. The ATBM7812 utilizes UMC’s proprietary URAM embedded memory technology on 300mm wafers to enable higher performance and smaller chip size.
The ATBM7812 is in full compliance with the following latest DVB specifications:
- ETSI EN 302 755 V1.3.1 (DVB-T2)
- ETSI EN 300 744 V1.6.1 (DVB-T)
- ETSI EN 300 429 V1.2.1 (DVB-C)
- ETSI EN 302 307 V1.2.1 (DVB-S2)
- ETSI EN 300 421 V1.1.2 (DVB-S)
In addition, the ATBM7812 fully satisfies the following latest agency specifications (RF components):
- NorDig Unified Spec V2.4 and NorDig Unified Test Spec V2.2.2
- D-Book 7 V2
A team of AltoBeam engineers successfully demonstrated an ATBM7812-powered STB in the Broadcast Asia Conference held in Singapore between June 18 and 21, 2013. The ATBM7812 showed excellent receiving robustness in demodulating various DVB-T2 broadcasting signals, including multi-PLP with L1 post-scrambling and T2-Lite.
“AltoBeam is a leader in the Chinese DTMB market with majority market share,” said
Dr. Steve Chaohuang Zeng,
CEO of AltoBeam. “The release of the ATBM7812 helps us expand beyond the Chinese market and further strengthens our position in the DTV space. Currently, over a dozen manufacturers have started designs using the ATBM7812.” “The ATBM7812 reconfirms AltoBeam’s commitment to the digital TV broadcasting,” added
, VP of International Sales for AltoBeam. “We look forward to serving the DVB market with the level of product performance and customer support that has been our trademark in the DTMB market.”
Steve Wang, vice president of Asia sales division at UMC, said, “We are happy to bring the benefits of UMC’s leading-edge technologies to leading China customers such as AltoBeam. With highly comprehensive technology solutions that include our proven 300mm URAM process, we look forward to further partnering with China’s IC design companies to increase their market competitiveness.”