SAN JOSE, Calif.
July 23, 2013
/PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that its laser spike annealing (LSA) technology has been selected as a primary 450-mm millisecond annealing tool for the Global 450-mm Consortium (G450C), headquartered at
College of Nanoscale Science and Engineering (CNSE) in
, NY. Utilized by leading IDMs and foundries around the globe, Ultratech's 300-mm LSA system is now implemented as the preferred technology for high-volume manufacturing of advanced logic devices from the 40- to 14-nm nodes. Built on the customizable Unity Platform™, the LSA's scanning system has fundamental advantages in uniformity and low-stress processing, which make it readily scalable to 450-mm applications. Ultratech will deliver its 450-mm LSA system for the G450C program's 450-mm equipment line in late 2013.
G450C is a public-private partnership announced by
Andrew M. Cuomo
to facilitate the 450-mm wafer size transition. It is spearheaded by CNSE in partnership with Intel, IBM, GLOBALFOUNDRIES, Samsung and TSMC. The new 450-mm cleanroom is located at CNSE's Albany NanoTech Complex within the NanoFab Xtension (NFX) expansion.
Arthur W. Zafiropoulo
, Chairman and Chief Executive Officer, stated, "LSA's advantages of low pattern effects, full-wafer temperature control, and low-stress processing have been demonstrated in high-volume manufacturing at 300mm, and now we will carry those same advantages to the 450-mm wafer size. Because LSA is a scanning system, it is quite straightforward to scale the system to larger wafer sizes, as compared to full-wafer processing systems. Furthermore, we are now seeing an increase in LSA applications beyond the ultra-shallow junction formation, and we expect this trend to continue as we move to smaller device nodes where 450mm will be adopted. With our flexible and extendible LSA product line, Ultratech is strategically positioned to meet its customers' advanced processing needs. We are very excited to be a part of the G450C program at CNSE, which is leading the industry transition to 450-mm technology as it ramps its 450-mm manufacturing line. The 450-mm LSA system is an example of our company's ongoing focus to provide cost-effective, leading-edge technology that enables competitive advantages for our global customers."
Paul Farrar Jr.
, CNSE Vice President for Manufacturing Innovation and General Manager of G450C, said, "Under the leadership and vision of Governor
is firmly established as the hub for the critical industry transition to 450-mm wafer technology. We look forward to working closely with Ultratech and utilizing its capabilities to help enable the important transition to 450-mm technology."
This release includes forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements can generally be identified by words such as "anticipates," "expects," "thinks," "intends," "believes," "estimates," and similar expressions and include management's expectation of its longerterm prospects for success. These forward-looking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forward-looking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers; quarterly revenue fluctuations; industry and sector cyclicality, instability and unpredictability; market demand for consumer devices utilizing semiconductors produced by our clients; our ability to manage costs; new product introductions, market acceptance of new products and enhanced versions of our existing products; our lengthy sales cycles, and the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; competition and consolidation in the markets we serve; rapid technological change; pricing pressures and product discounts; our ability to collect receivables; product concentration and lack of product revenue diversification; inventory obsolescence; general economic, financial market and political conditions and other factors outside of our control; domestic and international tax policies; cybersecurity threats in
the United States
and globally that could impact our industry, customers, and technologies; and other factors described in our SEC reports including our Annual Report on Form 10-K filed for the year ended
December 31, 2012
, and our Quarterly Report on Form 10-Q for the three months ended
, 2013. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.
Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front-end semiconductor, back-end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high-brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market, and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: