During the 25th International Symposium on Power Semiconductor Devices and Integrated Circuits (ISPSD) 2013, Dan Kinzer, Chief Technology Officer for Fairchild Semiconductor, was awarded the “ISPSD Contributory Award.”
The ISPSD Contributory Award was established at the ISPSD conference in 2001 and is presented to members who have made outstanding contributions to expanding technical fields. In commemoration of the 25th anniversary of ISPSD, Dan Kinzer was one of eight individuals selected to receive this honor, for his over 20 years of involvement and contribution to the establishment and growth of ISPSD as a world-leading international symposium in the field of power semiconductor devices.
Dan Kinzer joined Fairchild Semiconductor in 2007, as Senior Vice President of Product and Technology Development, and was appointed Chief Technology Officer and Senior Vice President for Technology in December 2010. His responsibilities include leading the semiconductor device, process, and packaging technology developments. In addition, he is responsible for technology strategy, technology staffing and development, and business and manufacturing strategy as it relates to technology. He is also leading Silicon Carbide technology development.
Mr. Kinzer is the inventor of over 100 US Patents and multiple international patents, author of numerous scientific and trade articles, served as General Chairman of the ISPSD, and is a member of IEEE and EDS. He received his BSE degree from Princeton University in 1978 in Aerospace and Mechanical Sciences with a concentration in Engineering Physics.The ISPSD is an international meeting ground for researchers, engineers, scientists, and specialists in the various research and development fields of power devices, bringing together power devices and power ICs community experts to enhance and drive forward the research and development of power electronics and its applications. The ISPSD has become the world’s leading conference in the field of power devices and power ICs due to the wealth of technical work presented and we are looking forward to a great conference this year as well.