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Synopsys Collaborates With A*STAR IME To Optimize TSI Technology

MOUNTAIN VIEW, Calif. and SINGAPORE, June 24, 2013 /PRNewswire/ --

  • Collaboration will provide the framework for heterogeneous 2.5D/3D-IC systems
  • Will optimize silicon interposer technology for lower cost and higher performance

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that it will join Singapore's A*STAR Institute of Microelectronics (IME)-led 2.5D TSI Consortium to provide the framework for heterogeneous 3D-IC systems using through-silicon interposer (TSI) technology. Synopsys will contribute its market expertise to the consortium to optimize TSI technology for cost-effective and performance-driven applications. The consortium's research and development efforts will lead to the demonstration of a heterogeneous 2.5D-IC design and manufacturing flow.

The electronic systems market is continually driving the demand for higher performance and functionality at lower cost. While traditional semiconductor technologies utilized in system-on-chip (SoC) devices continue to advance, the limitations in multi-chip systems, including interconnect density and inter-device bandwidth, are constraining system performance improvements. In addition, when multiple semiconductor technologies (such as MEMS, RF, analog and DRAM) are packaged independently from the system processor and related logic functions, it further impacts performance and cost. 3D-IC integration is an emerging solution for heterogeneous, multi-die and package systems. 2.5D-IC, a form of 3D-IC integration, combines silicon interposer, microbump and through-silicon via (TSV) technologies to enable the integration of heterogeneous, multi-die systems in a single package. In comparison to systems that contain the die packaged separately, 2.5D-IC offers many potential benefits, including higher system bandwidth, smaller form factor and faster time to product.

"Collaborating with industry leaders is essential to our 2.5D/3D-IC research and development roadmap," said Professor Dim-Lee Kwong, executive director of IME. "Through the consortium, a valuable resource sharing platform is formed where different fields of expertise and knowledge are readily available to optimize the research efforts and advance the market adoption of 2.5D integration for a wide range of applications."

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