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FREMONT, Calif., June 17, 2013 (GLOBE NEWSWIRE) --
Aehr Test Systems (Nasdaq:AEHR),
a worldwide supplier of semiconductor test and burn-in equipment, today announced that Gayn Erickson, President and CEO, will present at the Fifth Annual CEO Investor Summit 2013, Wednesday, July 10, 2013 in San Francisco, California.
About The Fifth Annual CEO Summit
The CEO Summit is an accredited investor and publishing research analyst event that is held concurrently with SEMICON West and Intersolar 2013 in San Francisco. The event is hosted by executive management from participating companies and will feature a "round-robin" format consisting of small group meetings, each 25 minutes in duration.
The CEO Investor Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. The last day for registration is June 21, 2013.
While held concurrently with SEMICON West and Intersolar 2013, the event is not affiliated with the show.
RSVP Contacts for Fifth Annual CEO Summit 2013
To RSVP for the CEO Summit, please contact either of the Summit's co-chairs.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and wafer level test. Aehr Test has developed and introduced several innovative products, including the ABTS
TM and FOX
TM families of test and burn-in systems and the DiePak® carrier. The ABTS system is used in production and qualification testing of packaged parts for both low-power and high-power logic as well as all common types of memory devices. The FOX system is a full wafer contact test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die. For more information, please visit the Company's website at