FREMONT, Calif., May 2, 2013 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received over $1 million in follow-on production orders for its burn-in and test systems from a leading manufacturer of advanced logic integrated circuits (ICs) for embedded processing, digital signal processing, wireless and analog applications. The systems are expected to ship within the next 6 months.
"We are pleased to receive these follow-on orders which further validate that burn-in and test using Aehr Test's systems is a cost-effective solution for production reliability screening of a wide range of ICs," said Larry Anderson, vice president of sales at Aehr Test Systems. "We are seeing a definite increase in activity from many of our customers around the world, especially those who manufacture ICs for the automotive market. We are well-positioned with both our MAX TM and ABTS TM product lines to serve the high-reliability requirements of the automotive IC market, which according to IC Insights, a leading semiconductor research company, is forecast to grow at a rate 20% greater than the IC market as a whole over the next 5 years."
"In addition to full-size MAX4 TM systems for production burn-in and test, an Engineering Workstation (EWS) for Aehr's ABTS advanced test and burn-in system for high-power parts was ordered," Anderson continued. "The EWS is very helpful for developing test programs for new devices, easing the transition to the new ABTS platform."The ABTS family of products is based on a new hardware and software platform that is designed to address not only today's devices, but also future devices for many years to come. It can test and burn-in both logic and memory devices, including resources for high pin-count devices and configurations for high-power and low-power applications. The ABTS system can be configured with up to 72 burn-in boards with up to 320 I/O channels each and 32M of test vector memory per channel. The ABTS system is optimized for use with the Sensata iSocket* Thermal Management Technology, which provides a scalable cost-effective solution using individual device temperature control for ICs up to 75 watts or more. Individual temperature control enables high-power devices with a broad range of power dissipation to be burned-in simultaneously in a single burn-in chamber while maintaining a precise device temperature. The ABTS system also uses N+1 redundancy technology for many key components in the system to maximize system uptime.