In this report, we'll also show that as MEMS moves from competing on process technology to competing on functions and systems, a move towards more standard solutions will be necessary to drive down package size and cost. Currently, MEMS foundries still compete at the process level and have to propose a wide range of processes in order to cope with new MEMS designs and structures. This approach differs from fabless companies, which usually focus on one type of MEMS design. Their main objective is to find the most experienced and reliable foundry partner in order to convince customers of their expertise. IDMs, meanwhile, generally rely on robust and established MEMS processes to manufacture their products (i.e. THELMA for ST). Foundries, which must always remain at the forefront of changes in the MEMS manufacturing landscape, have the biggest challenge.TSV & UNIQUE WAFER STACKING SOLUTIONS ARE KEY ENABLERS FOR REDUCING DIE SIZE AND COST
MEMS Front-End Manufacturing Trends
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