MEMS Front-End Manufacturing Trends
NEW YORK, March 20, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
MEMS Front-End Manufacturing Trends http://www.reportlinker.com/p01136207/MEMS-Front-End-Manufacturing-Trends.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor
CHANGES IN MEMS MANUFACTURING WILL DRIVE THE EQUIPMENT & MATERIALS MARKET FROM $378M TO $512M FOR EQUIPMENT AND $136M TO $248M FOR MATERIALS BETWEEN 2012-2018
Innovative processes are fueling the MEMS equipment & materials market. We forecast that demand for MEMS-related equipment will grow from ~ $378M in 2012 to > $510M by 2018, at a CAGR of 5.2% over the next five years. It's interesting to note that our MEMS equipment market forecast will follow a cyclical up/downturn similar to what the mainstream IC equipment market underwent. The demand for materials and related MEMS consumables will grow from ~$136M in 2012 to > $248M by 2018 at a CAGR of 10.5% over the next five years.AS MEMS BECOME COMMODITY PRODUCTS, MANUFACTURING WILL CHANGE AND MATURE Today, MEMS fabrication is still very diversified and lacking in standardization; Yole Développement's rule « one product, one process » still applies. Indeed, MEMS has a different story than IC and doesn't follow the same roadmap as the semiconductor industry. Thus, it's still common to see many players with radically different manufacturing approaches for the same MEMS device, sometimes within the same company (i.e. both the CMOS MEMS and hybrid approaches can be used for inertial devices or microphones). However, as MEMS becomes a commodity product with a quicker time-to-market compared to previous generations, anything that speeds up the commercialization process is welcome. MEMS packaging is evolving in a different direction than front-end processing, and Yole Développement has already identified that packaging standardization will become increasingly critical in order to support the massive volume growth in unit shipments, and decrease overall costs associated with MEMS & sensor content. For example, microphone packaging is very similar between one manufacturer and another. Additionally, this report shows that at the front-end level, companies are developing in-house technological platforms targeted for different MEMS devices.
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