This Day On The Street
Continue to site right-arrow
This account is pending registration confirmation. Please click on the link within the confirmation email previously sent you to complete registration.
Need a new registration confirmation email? Click here
Cramer's Action Alerts PLUS - See his portfolio and get alerts BEFORE every trade. Learn more NOW!

FlipChip International Announces Elite™ OPM Technology For High Yield Copper Wire Bonding On Multiple Nodes Of Semiconductor Devices

PHOENIX, March 18, 2013 /PRNewswire/ -- FlipChip International (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today its Elite™ OPM technology which provides a wider process window for copper wire bonding to support the growing transition of customer products away from costly gold wire.   OPM technology will be available from FlipChip Millennium Shanghai facility (FCMS), a subsidiary of FCI, and will provide an integral landing pad protection of the underlying semiconductor device for a broad variety of Semiconductor devices and Technology nodes.   

Ted Tessier, CTO of FCI said, "This innovative and patented solution originated in FCI's Corporate R&D Center in Phoenix, Arizona and was further deployed into volume manufacturing at our Shanghai FCMS wafer bumping facility.   As a result of the close collaboration with our subsidiary Millennium Microtech Shanghai (MMS) and its wire bonded package customers, Elite™ OPM is being introduced to address ongoing cost reduction needs and critical Reliability concerns such as pad cratering and pad peeling.   The rugged structural characteristics of Elite™ OPM enhanced pads ensure crater-free copper wire bonding with high yields in mass production".

"We are also currently evaluating IC devices designed with circuit-under-pads which is a common miniaturization design structure.  Based on our initial results, the OPM protected pads have provided robust protection of the circuits underneath, and the electronic performance of the device. We believe that IC designers will be able to utilize the benefits of Elite™ OPM to enable the design of smaller devices without package related concerns.  This product announcement is the first example of the synergy unleashed by our acquisition of MMS in mid-2012.  FCI expects to make further announcements in flip chip and 3D packaging technology within the next few months."

FCMS has initiated mass production Elite™ OPM services for copper wire bonding in March 2013.

FCI is a privately held supplier of products and services for the wafer bumping and wafer level packaging market. Its subsidiaries include FCMS and MMS. Both are located in Shanghai.

For information contact:Dawn Cuevas                                                                          FlipChip International, LLC                                                      #602-431-6637                                                                                                                                                                 :    

SOURCE FlipChip International

Copyright 2011 PR Newswire. All rights reserved. This material may not be published, broadcast, rewritten or redistributed.

Check Out Our Best Services for Investors

Action Alerts PLUS

Portfolio Manager Jim Cramer and Director of Research Jack Mohr reveal their investment tactics while giving advanced notice before every trade.

Product Features:
  • $2.5+ million portfolio
  • Large-cap and dividend focus
  • Intraday trade alerts from Cramer
Quant Ratings

Access the tool that DOMINATES the Russell 2000 and the S&P 500.

Product Features:
  • Buy, hold, or sell recommendations for over 4,300 stocks
  • Unlimited research reports on your favorite stocks
  • A custom stock screener
Stocks Under $10

David Peltier uncovers low dollar stocks with serious upside potential that are flying under Wall Street's radar.

Product Features:
  • Model portfolio
  • Stocks trading below $10
  • Intraday trade alerts
14-Days Free
Try it NOW
Only $9.95
Try it NOW
14-Days Free
Try it NOW

Check Out Our Best Services for Investors

Dividend Stock Advisor

David Peltier identifies the best of breed dividend stocks that will pay a reliable AND significant income stream.

Product Features:
  • Diversified model portfolio of dividend stocks
  • Updates with exact steps to take - BUY, HOLD, SELL
Trifecta Stocks

Every recommendation goes through 3 layers of intense scrutiny—quantitative, fundamental and technical analysis—to maximize profit potential and minimize risk.

Product Features:
  • Model Portfolio
  • Intra Day Trade alerts
  • Access to Quant Ratings
Options Profits

Our options trading pros provide over 100 monthly option trading ideas and strategies to help you become a well-seasoned trader.

Product Features:
  • Actionable options commentary and news
  • Real-time trading community
Try it NOW
Try it NOW
Try it NOW
To begin commenting right away, you can log in below using your Disqus, Facebook, Twitter, OpenID or Yahoo login credentials. Alternatively, you can post a comment as a "guest" just by entering an email address. Your use of the commenting tool is subject to multiple terms of service/use and privacy policies - see here for more details.
Submit an article to us!


DOW 17,678.23 -97.89 -0.55%
S&P 500 2,057.64 -10.25 -0.50%
NASDAQ 4,863.3310 -37.5540 -0.77%

Partners Compare Online Brokers

Free Reports

Free Newsletters from TheStreet

My Subscriptions:

After the Bell

Before the Bell

Booyah! Newsletter

Midday Bell

TheStreet Top 10 Stories

Winners & Losers

Register for Newsletters
Top Rated Stocks Top Rated Funds Top Rated ETFs