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Nordson MARCH, a global leader in plasma processing technology, received the
New Product Introduction (NPI) Award for its FlexVIA
™ Plasma System, a completely self-contained vacuum plasma system designed for maximum efficiency and cost-effective etch, desmear and surface activation treatment of flexible printed circuit boards (PCBs). The award, presented by
Printed Circuit Design & Fab magazine on February 19
th, was determined by judging criteria that included innovation, cost effectiveness, environmental friendliness, ease-of-use, speed, throughput, design and performance.
FlexVIA Plasma System is used during PCB manufacture to uniformly treat the inner surface layer of flex PCBs prior to lamination for improved adhesion and reliability. The system features a space-saving, compact chassis and an advanced horizontal electrode design to provide optimum material alignment. Utilizing patented plasma technology, the FlexVIA System does not require the use of temperature control, a blower, or expensive fluorine gases. Environmentally friendly and cost-effective gas plasma solutions, such as argon (Ar) and oxygen (O
2), are utilized to maximize cost savings. The dual-rack chamber accommodates up to eighteen 20 x 24 inch panels in a single cycle and both sides of the flex material surface area are treated in a single-step process enabling a rate of 80 to 120 units per hour (UPH).