Qualcomm also announced today a new RF transceiver chip, the WTR1625L. The chip is the first in the industry to support carrier aggregation with a significant expansion in the number of active RF bands. The WTR1625L can accommodate all cellular modes and 2G, 3G and 4G/LTE frequency bands and band combinations that are either deployed or in commercial planning globally. Additionally, it has an integrated, high-performance GPS core that also supports GLONASS and Beidou systems. The WTR1625L is tightly integrated in a wafer scale package and optimized for efficiency, offering 20 percent power savings compared to previous generations. The new transceiver, along with the Qualcomm RF360 front end chips, is integral to Qualcomm Technologies Inc.'s single-SKU World Mode LTE solution for mobile devices that are expected to launch in 2013.
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Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including Qualcomm Technologies' ability to successfully design and have manufactured significant quantities of Qualcomm RF360 Front End components on a timely and profitable basis, the extent and speed to which the Qualcomm RF360 Front End components are deployed, change in economic conditions of the various ecosystems that Qualcomm Technologies' serves, as well as the other risks detailed from time to time in Qualcomm Incorporated's SEC reports, including the report on Form 10-K for the year ended September 25, 2012, and most recent Form 10-Q. Qualcomm Incorporated and Qualcomm Technologies undertake no obligation to update, or continue to provide information with respect to, any forward-looking statement or risk factor, whether as a result of new information, future events or otherwise.Qualcomm is a registered trademark of Qualcomm Incorporated. All other trademarks are the property of their respective owners.