"The wide range of radio frequencies used to implement 2G, 3G and 4G LTE networks globally presents an ongoing challenge for mobile device designers. Where 2G and 3G technologies each have been implemented on four to five different RF bands globally, the inclusion of LTE brings the total number of cellular bands to approximately 40," said Alex Katouzian, senior vice president of product management, Qualcomm Technologies, Inc. "Our new RF devices are tightly integrated and will allow us the flexibility and scalability to supply OEMs of all types, from those requiring only a region-specific LTE solution, to those needing LTE global roaming support."
The Qualcomm RF360 front end solution also represents a significant technological advancement in overall radio performance and design, and it comprises the following components:
- Dynamic Antenna Matching Tuner (QFE15xx) – The world's first modem-assisted and configurable antenna-matching technology extends antenna range to operate over 2G/3G/4G LTE frequency bands, from 700-2700 MHz. This, in conjunction with modem control and sensor input, dynamically improves the antenna's performance and connection reliability in the presence of physical signal impediments, like the user's hand.
- Envelope Power Tracker (QFE11xx) – The industry's first modem-assisted envelope tracking technology designed for 3G/4G LTE mobile devices, this chip is designed to reduce overall thermal footprint and RF power consumption by up to 30 percent, depending on the mode of operation. By reducing power and heat dissipation, it enables OEMs to design thinner smartphones with longer battery life.
- Integrated Power Amplifier / Antenna Switch (QFE23xx) – The industry's first chip featuring an integrated CMOS power amplifier (PA) and antenna switch with multiband support across 2G, 3G and 4G LTE cellular modes. This innovative solution provides unprecedented functionality in a single component, with smaller PCB area, simplified routing and one of the smallest PA/antenna switch footprints in the industry.
- RF POP™ (QFE27xx) – The industry's first 3D RF packaging solution, integrates the QFE23xx multimode, multiband power amplifier and antenna switch, with all the associated SAW filters and duplexers in a single package. Designed to be easily interchangeable, the QFE27xx allows OEMs to change the substrate configuration to support global and/or region-specific frequency band combinations. The QFE27xx RF POP enables a highly integrated multiband, multimode, single-package RF front end solution that is truly global.
OEM products featuring the complete Qualcomm RF360 Solution are anticipated to be launched in the second half of 2013.