Rambus Inc.(NASDAQ: RMBS):
|Where:||International Solid-State Circuit Conference|
|Marriott Marquis Hotel|
|San Francisco, CA|
|When:||February 20, 2013 at 8:30 a.m.|
Rambus engineers will demonstrate and present innovations for future main memory systems at the 2013 International Solid-State Circuit Conference (ISSCC), the premier forum for showcasing advances in solid-state circuits.
The presentation will highlight a single-ended, low-signal swing transceiver that couples high-speed (up to 6.4Gb/s) read/write capabilities with industry leading power efficiency. This technology can satisfy the demand for high-density, low power and high-speed memory interfaces in cloud computing environments.
Demonstration Session Details:Title: A 6.4Gb/s Near-Ground Single-Ended Transceiver for Dual-Rank DIMM Memory Interface Systems 8:30 a.m. – 9:00 a.m. For additional details, visit: www.rambus.com.
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