Electro Scientific Industries, Inc.
(NASDAQ: ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that its DiamondBlaze™ product line cuts Corning’s line of chemically strengthened glass products including Corning® Concore™ Glass and its next generation of damage-resistant glasses for Integrated Touch Cover Glass applications.
Corning’s® newest glass enables thinner, lighter, and lower cost touch screens for consumer devices while offering improved resistance to damage and retained strength. ESI’s considerable knowledge of laser systems and microfabrication technologies enables significant cost savings for touch panel manufacturers while offering an improved product performance for the One-Glass-Solution market.
The DiamondBlaze™ product line employs the laser-based micro-disruption™ process to singulate strengthened glass with increased line yield, fast cutting speeds and minimal edge damage. ESI’s proprietary process delivers optimal yields on Corning’s® Concore™ Glass product with a central tension (CT) extending well above 45 MPa; the DiamondBlaze™ has also been demonstrated to cut previous generations of chemically strengthened glass.
Corning’s® Concore™ Glass and ESI’s DiamondBlaze™ combine to meet the consumer electronics manufacturers’ demands for stronger, thinner materials with lower cost of ownership. “We are very excited about the introduction of this new product line and the growth opportunities it presents. We believe the cost of ownership provided by the DiamondBlaze™ product line will allow quick adoption of Corning’s new glass. The micro-disruption™ technology is innovative in its simplicity, yet powerful in its application,” said Crosby Peck, Sr. Director of Business Development.
The DiamondBlaze™ product line supports up to Gen 6 manufacturing lines. All systems support factory automation for ease of system integration into existing and future factory floors.
About ESI, Inc.
ESI is a leading supplier of innovative, laser-based manufacturing solutions for the microtechnology industry. Our systems enable precise structuring and testing of micron to submicron features in electronic devices, semiconductors, LEDs and other high-value components. We partner with our customers to make breakthrough technologies possible in the microelectronics, semiconductor and other emerging industries. Founded in 1944, ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at
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