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BOISE, Idaho and
NEWPORT BEACH, California,
January 31, 2013 /PRNewswire/ --
American Semiconductor, Inc. announces TowerJazz, the global specialty foundry leader, is the first foundry with a CMOS process (CS18) available for physically flexible wafers and integrated circuits (ICs) utilizing FleX™ Silicon-on-Polymer.™ This announcement was made at the 12th annual Flexible & Printed Electronics Conference presented by the FlexTech Alliance being held in
Phoenix, Arizona on
January 29 - February 1, 2013.
FleX Silicon-on-Polymer is American Semiconductor's process for transforming standard silicon wafers into flexible wafers that can be bent, conformally mounted to non-flat surfaces, and integrated with printed electronics to create flexible hybrid systems. "FleX has been successfully demonstrated in various prototype processes," said
Rich Chaney, General Manager of American Semiconductor. "Partnering with TowerJazz to release FleX with their foundry CS18 process will greatly expand the availability of flexible ICs and is a benefit to the flexible electronics community."
"FleX is a post-fabrication process that can be applied to our production SOI technology making it possible to turn any product into a flexible die helping our customers create new, differentiated solutions," said Dr.
Marco Racanelli, Sr. Vice President of TowerJazz. "We are excited to partner with ASI and look forward to jointly participating in the growth of this new market."
American Semiconductor offers full support for FleX IC and flexible hybrid system development. This includes IC design support for all TowerJazz CMOS processes, including CS18-FleX. Design support is available for full custom IC design, IP development or integration, or any part of the design flow which a customer might want assistance with. Engineering support for flexible hybrid systems includes printed electronics design and fabrication, FleX integration, and prototype development.