Mentor Graphics Announces New HyperLynx Technology With Advanced 3D Channel And Trace Modeling, Superior Accuracy And Fastest Simulation Performance

Mentor Graphics Corporation (NASDAQ: MENT) today announced the newest release of its market-leading HyperLynx® product for superior high-speed design and analysis. Key features in the new HyperLynx product release include advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance—up to 5X faster. Engineers and designers who use the HyperLynx products during the system design process can quickly analyze potential high-speed design issues that can impact signal integrity, power integrity, and electromagnetic interference (EMI) performance. These new capabilities will improve product quality and performance by correcting problems earlier in the design process with minimized risk and greater productivity.

“In applications above 10 Gbps, insertion loss will often exceed -12 dB at the Nyquist and eyes will be completely closed. Successful designs require getting everything in the design right and building confidence in the design early in the design cycle with accurate simulations,” stated Eric Bogatin, signal integrity evangelist, Bogatin Enterprises, a wholly owned subsidiary of Teledyne-LeCroy. “The accuracy of the latest release of Mentor Graphics HyperLynx was recently validated with a 12.5 Gbps backplane design from Molex that included causal material models, copper surface texture contributions, via models, mode conversion and reflections from integrated S-parameter models of connectors.”

Advanced Channel and Trace Modeling

The new HyperLynx product decreases the amount of channel modeling that requires 3D analysis with advanced area fill-aware 2.5D planar trace extraction. When this advanced feature is enabled, the system will model variations in signal trace impedance or delays due to non-ideal planes and references (complex area fills with voids and cuts). The resulting impedance variation effects are included during time domain simulation and s-parameter model extraction.

Where necessary, the HyperLynx product also provides full 3D extraction and modeling. The designer can quickly select board areas for 3D full wave analysis, including exporting the full channel to the schematic editor for auto-port creation, assignment and simulation, tightly integrating the HyperLynx 3D EM full wave solver.

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