Rambus Inc. (NASDAQ: RMBS)
|Who:||Rambus Inc. (NASDAQ: RMBS)|
|Santa Clara Convention Center|
|Santa Clara, CA|
|When:||January 28 – 31, 2013|
At DesignCon 2013, Rambus engineers and scientists will present six technical papers on topics such as: mixed signal designs, 3D interposer design, memory controllers and 3D DRAM, high-speed coded differential signaling, and high-speed parallel buses.
Additionally, Rambus will be demonstrating various innovations in its booth (#301), including: R+ technologies for extending main memory beyond DDR4, R+ DDR3 memory interface solution, R+ DDR3/GDDR5 multi-modal interface technology, and 3D IC memory technology from Rambus Labs. For additional details, visit www.rambus.com.
Rambus Presentations:Tuesday, January 29, 2013 Title: A Reusable Generic Platform for Validation and Characterization of High-Speed Mixed Signal Designs 8 :30 a.m. – 9:10 a.m. – Ballroom D Sanku Mukherjee, Narayanan Mayandi, Brian Tsang, Sreeja Menon, Norman Chan and Arul Sendhil, Rambus Inc. Rambus scientists and engineers will share innovations around a reusable test chip architecture, a generic package and a generic PCB infrastructure for fast validation of mixed signal IP.
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