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FOWLP & Embedded Die Packages

Scope of the Report & Definitions p 4

Executive Summary p 11

Embedded Die in Substrates of Active ICs & Passive Components p 48

• Motivations and Drivers p 49

• Application focus for Embedded die package commercialization p 64

- cell-phone & consumer, automotive, medical applications

• 2010-2020 market forecasts for Embedded packages p 91

- in package shipments (M units)

- in packaging revenues ($M)

• Supply chain emerging for embedded dies p 98

- Players and position in the electronic value chain

- Who is the most aggressive in commercialization?

- Who is doing what: partnerships identified

• Equipment & Material Toolbox for Embedded die p 129

- Technology flavors for embedded package. Chip first versus chip last?

- Single die embedding versus SiP module? Challenges related to yield & supply chain

• Cost structure for Embedded package manufacturing p 134

• Conclusion on "sweets spots" for the introduction of Embedded die technology in the short / medium / long term p 138

FOWLP Technology Development p 140

• Motivations and market drivers p 144

- Form factor, Cost, electrical and thermal performance

• Supply chain emerging for FOWLP p 162

- Players and position in the electronic value chain. Who is the most aggressive in commercialization? Who is doing what: partnerships identified

• 2010-2020 market forecasts for FOWLP type of packages p 174

- In Package shipments (M units)

- In epoxy wafer production (wspy eq.)

- In Packaging revenues ($M)

• FOWLP technologies & challenges p 202

- 1st generation versus 2nd generation FOWLP. "Passive integration with FOWLP technologies

• Equipment & Materials for FOWLP p 213

- Challenges in new material selection and missing equipment

- Technology roadmap for FOWLP development

• 2.5D integration trends based on FOWLP and silicon / glass interposer mix p 227

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