TWO MAIN OSATs SUPPORTING FOWLP INFRASTRUCTURE TODAY. FOUR MORE PLAYERS TO COME NEXT!
FOWLP is clearly the "Middle-end" platform of choice for packaging assembly & test 'OSAT' suppliers of the IC industry, as all implies a simplification and consolidation of the entire packaging, assembly & test and supply chain inside one single factory.
NANIUM (PT) and STATS ChipPAC (SG) shared more than 80% of the
FOWLP activity revenue last year, mainly driven by Intel Mobile's volume demand on eWLB production. While ASE (TW) is shutting down its 200mm eWLB operations this year to focus on future generation FOWLP technologies, many OSAT players are presently in qualification phase such as ADL (TW), Amkor (KR) and NEPES (SG). Additional packaging houses are expected to come onboard in the 2013 – 2014 time frame such as TSMC (TW), SPIL (TW) and J-Devices (JP). More details on the supply chain challenge and the partnership already in place are provided in this research report update.
EMBEDDED DIE PACKAGE PLATFORM SUCCESSFULLY ENTERED THE SiP MODULE BUSINESS
Meanwhile, the embedded die in package industry has taken a giant step forward in 2011 since AT&S (AT) and TI (US) started the commercialization of microSiP DC/DC converter modules with critical mass volume, production of >100M units this year, driven by the mobile market. Rohm (JP) and Epcos-TDK (JP) would be the second source of the same microSiP power conversion module in the mobile handset supply chain of RIM (CA). IC substrate suppliers Taiyo-Yuden (JP) and Fujikura (JP) are also getting ready to ramp-up their internal assembly lines for embedded die packaging. This will bring the total number of players to 4 in the near future, with separate supply chains able to support the embedded die in package technology commercialization.
Today, main roadblocks for embedded die package commercialization are mainly linked to low manufacturing yields (75-85% overall) and supply chain settlement issues in both the embedded die wafer preparation as well as in back-end assembly & test operations. Again, only a large semiconductor IDM company such as Texas Instruments (Us) could successfully lead the commercialization of this new packaging assembly platform by filling the gaps (in terms of investment, risk and know-how) and settle the supply chain.