FOWLP & Embedded Die Packages
NEW YORK, Jan. 24, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
FOWLP TECHNOLOGY IS LOOKING FOR NEW DRIVING FORCES BEYOND INTEL MOBILE'S PUSHAfter growing fast since Infineon's strong push for eWLB technology commercialization, the FOWLP market activity reached the $100M market valuation last year. This young industry will need to wait for the 2015 – 2016 time frame to reach $200M market as the demand will shift from IDMs to leading fab-less wireless IC players (such as Qualcomm, Broadcom, Mediatek, etc…) and will be supported by the solid infrastructure of 'top 4' major assembly houses. Additionally, to bend the rules, we also decided to propose in this report an alternative scenario for FOWLP market evolution. Indeed, regarding the numerous rumors linked to this space, several feedbacks pushed us to propose an optimistic forecast model, making the market starting growing fast as soon as 2013. This enthusiastic scenario would be linked to the following players' activity: Spreadtrum (CN), Maxim (US), ADL (TW), Mediatek (TW). However, low reliability on large package body size and lack of flexibility in the IC to package co-design process are the two main factors limiting the wide application scope of FOWLP technology on the wireless IC market today. Indeed, FOWLP technology impose a specific re-design of the chip for efficient integration into the package: both Infineon and STEricsson (who already have products on the market) spent almost 18 month to re-design their baseband and RF-Transceiver SOCs in order to place the pads at optimized locations and match with a single RDL, 0.5mm board pitch eWLB package design. It is quite a lot of restrictions for most IC designers of the world to adopt this new package technology efficiently, especially for fabless chip companies. This is why only big semiconductor IDM companies having IC-to-package co-design environment well established in-house can drive and support the initial grow of this new wafer-level-packaging platform at its early beginning.
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