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DesignCon 2013 To Feature Visionary Keynotes, Live Teardowns & 120+ Presentations Customized For The Chip, Board & Systems Design Communities

Stocks in this article: UBM

SAN FRANCISCO, Jan. 17, 2013 /PRNewswire/ --  UBM Tech, the daily source of essential business and technical information for the electronics industry's decision makers, is gearing up to welcome thousands of manufacturers, engineers and industry executives to its annual DesignCon conference and expo.  DesignCon 2013, which will take place January 28-31 in Santa Clara, Calif., will feature three visionary keynotes, two live teardowns conducted by the hardware repair wizards of iFixit and more than 120 in-depth tutorials, technical paper sessions, training sessions and panel discussions all customized for the chip, board and systems design communities.

(Logo: http://photos.prnewswire.com/prnh/20130117/SF44391LOGO)

Replete with pertinent and innovative technical content designed to facilitate learning, networking and overall industry success, the 14-track DesignCon conference program addresses the pervasive challenge of signal integrity at all levels of electronic design.  Featuring more than 130 exhibitors, an educational forum sponsored by Agilent Technologies, the annual Design Vision awards, and the ever-popular Chiphead Theater, which will host two live product teardowns along with speed training demonstrations, panel discussions, the Best in Test Awards and DesignTOUR drawings, the DesignCon expo also features the in-depth and industry-specific content that adds to DesignCon's reputation as the definitive annual event for the semiconductor and electronic design engineering communities. 

"We take great pride in evaluating, recruiting and facilitating the sharing of the most timely and relevant information within the chip, board and systems design communities at DesignCon each year, but are particularly excited about this year's keynote speakers, events and content," said Patrick Mannion, Content Director at UBM Tech.  "DesignCon 2013 is a definite don't-miss event for the design engineering community." 

Bill Swift, Vice President of Engineering for the Silicon Engineering Team at Cisco Systems, will deliver the initial keynote address at 12:30pm on Monday, Jan. 28 in Mission City Ballroom B.  Currently responsible for silicon development engineering for Cisco's service provider, enterprise and high-end switching-based products, Swift plans to discuss the accelerated pace of innovation required to build intelligent networks capable of supporting the exponentially expanding demands fueled by increasingly networked technologies and societies.  According to Swift, technological innovation in programmable networks, the next wave of silicon development and the ability to facilitate ASIC power solutions are key to advancements in intelligent networking for 2013. 

Jonah Alben, Senior Vice President of GPU Engineering at NVIDIA, will deliver DesignCon's second keynote address, which will focus on the challenges of sustaining investment in methodology to keep up with ever increasing design complexity and the  promising results of one of NVIDIA's latest methodology investments, the application of GPUs to EDA, at 12:00pm on Tuesday, Jan. 29 in Mission City Ballroom B.  Lastly, at 12:00pm on Wednesday, Jan. 30, Mike Santori, Business and Technology Fellow at National Instruments, will deliver the third and final keynote address, in which he plans to discuss the evolution of software-designed instrumentation and its implications for new approaches to test and design.   

Other exciting DesignCon presentations include two live teardowns of tech-savvy new gadgets, both of which will be held at the Chiphead Theater in the expo hall.  On Tuesday, Jan. 29 from 2:00-2:40pm, hardware repair experts iFixit will conduct a live teardown of the GoPro HERO3: Black Edition camera to uncover the technology behind the impressive specs that GoPro claims make it the world's most advanced camera.  On Wednesday, Jan. 30, iFixit will disassemble the Sonos Play:3 Wireless HiFi System to identify the technology responsible for its noteworthy networking and audio capabilities, all of which are housed in a compact 5.2" x 10.6" x 6.3" package, from 3:35-4:25pm.

DesignCon is supported by host sponsor Agilent Technologies, Corporate Sponsor Rambus, Diamond Sponsors Teledyne Lecroy and Sisoft and Platinum Sponsor Rohde & Schwarz.

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