Mercury Systems Announces Breakthroughs In Module And Subsystem Cooling Technologies For OpenVPX

CHELMSFORD, Mass., Dec. 18, 2012 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (Nasdaq:MRCY) ( www.mrcy.com ), a best-of-breed provider of commercially developed, open sensor and Big Data processing systems for critical commercial, defense and intelligence applications, announced industry-leading innovations in thermal management for air-cooled, conduction-cooled and VITA 48 subsystem chassis. These new solutions establish Mercury as a forerunner in addressing the insatiable industry demand for more processing performance at the mezzanine, module and system levels. Because more and more heat is generated by increasing levels of performance, discharging that heat out of today's advanced computing solutions is more challenging than ever.

"Our new thermal-management solutions are capable of dissipating tremendous amounts of thermal energy, while still meeting the same or smaller size, weight and power requirements for the overall solution," said Darryl McKenney, Vice President of Mercury's Engineering Services team. "By understanding the thermal profile for each specific component that makes up a system, we created innovations in the mass transfer of thermal energy that work at the individual component, module and subsystem level."

According to Paul Monticciolo, Vice President and CTO of Mercury Systems, "These new cooling technologies offer tremendous benefits for our customers that are looking to take advantage of current and future high-performance, high-power sensor processing technologies. We feel this technology will be quickly adopted into a wide range of applications; it's another example of Mercury innovation."

Air-Cooled Solution

Mercury's improved air-cooled integrated XMC thermal solution addresses the need for a standards-based approach to draw heat away from today's high-powered mezzanine cards, then onto the carrier module and ultimately out of the system in air-cooled environments. By adding "hooks" that connect to a thermal bridge between the card and module, the solution typically reduces mezzanine card temperatures by more than 5 degrees Celsius. This results in a five-times improvement in MTBF (mean time between failures), while remaining compliant with the VITA 48.1 mechanical specification for air cooling.

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