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Rudolph Enters Back-End Lithography Market With Breakthrough Total Solution For Advanced Packaging

Rudolph Technologies, Inc. (Nasdaq: RTEC) (“Rudolph” or the “Company”), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced today that it has entered the back-end advanced packaging lithography market with the new JetStep™ Lithography System, a disruptive innovation featuring a 2X reduction stepper. With the acquisition of Wilmington, Massachusetts-based Azores Corp. (Azores), a leader in the design, development, manufacture and support of steppers for display products, Rudolph is spurring an industry revolution by launching a game-changing total lithography solution for the semiconductor advanced packaging market based on Azores’ patented and established stepper technology and Rudolph’s significant back-end expertise.
  • Advanced packaging is in the early stages of dynamic growth; Yole Développement has forecast demand for equipment and related tools in the 3DIC and wafer-level packaging area to grow from approximately $370 million in 2010 to over $2.5 billion by 2016 at a CAGR of 38 percent over that period.
  • Azores acquisition expands Rudolph’s business model, enlarges the Company’s role within the advanced packaging market, and likely more than doubles Rudolph’s total addressable back-end market.
  • Rudolph’s total lithography system includes the JetStep 2X reduction stepper integrated with Rudolph’s equipment automation and fault detection software; the Company’s flagship NSX® inspection tool for CD overlay measurements; and for full, closed-loop control, includes ProcessWORKS ® APC software, the industry’s most comprehensive run-to-run control system, ARTIST ® fault detection and classification system, and the Company’s fabwide yield management system, Discover ®, which provides automated, real-time process control feedback.
  • The first JetStep System shipped to a packaging technology leader, who is a top-five outsourced assembly and test (OSAT) company. Rudolph is actively engaged with other leading IDM, fabless and OSAT companies.

JetStep—Lower Cost-of-Ownership with Compelling User Advantages from a Known Supplier to the Advanced Packaging IndustryRudolph’s entrance into the back-end lithography market underscores the Company’s strategic partnerships with an expanding customer base. Advanced packaging lithography has a completely different set of manufacturing requirements than those associated with front-end lithography, and its technical challenges are not readily addressed with existing solutions, which in the back-end have consisted primarily of projection aligners and 1X steppers.

The next-generation JetStep Lithography System is a revolutionary 2X reduction step-and-repeat tool, designed to give better device yields, higher throughput, and most importantly a lower cost-of-ownership today, while providing the basis for pursuing the challenges of a solid technical roadmap tomorrow. This transformative technology represents a paradigm shift for the industry and provides a total lithography solution that is fully customizable to the varying technical requirements of each customer, enabling them to more effectively compete in the high-growth advanced packaging market.

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