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InvenSense 3rd NF-Shuttle Ready For January 7 Launch

InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking devices for consumer electronics, today announced that its 3 rd NF-Shuttle that allows 3 rd-party developers to build MEMS prototypes on the company’s proprietary MEMS fabrication process is scheduled to launch on January 7. The company also announced it is now taking orders for its 4 th NF-Shuttle, which is slated to launch in May 2013. NF-Shuttle designs are fabricated on the same NF Platform that produced several hundred million inertial MEMS units for InvenSense.

Fari Assaderaghi, Vice President of Advanced Technology at InvenSense, noted, “Opening our NF Platform, this past May, to outside developers was a precedent-setting event for the MEMS industry. We are finding the decision to be rewarding to InvenSense, universities, research institutions and other MEMS developers that are seeking to accelerate their development timeframes. We are excited about the demand we have experienced to date and are looking forward to increasing our subscriber base over the coming year.”

Professor Bernhard Boser, Professor of Electrical Engineering at U.C. Berkeley, said, “For a DARPA-funded project on next-generation gyroscopes, we were in need of a fabrication process that allows for tight integration of a mechanical transducer and ultra-low noise electronics, and one that would provide silicon in a quick turnaround time. We found the InvenSense NF-Shuttle to be particularly well suited for our needs. Due to our success with the program, we are looking forward to fabricating additional designs on the NF Platform.”

About the NF-Shuttle

The InvenSense NF-Shuttle is a silicon CMOS-MEMS platform where mask costs are split amongst multiple users as they can purchase "seats" on the same mask. This approach reduces production costs for participants to a fraction of the total and thus provides a greater opportunity to verify their advanced designs and prototypes in silicon. To learn more about participating in InvenSense’s NF-Shuttle Program, please contact InvenSense at nfshuttle@invensense.com

About InvenSense’s Proprietary Fabrication Platform

The InvenSense NF Platform is able to combine MEMS on CMOS (also known as CMOS-MEMS) in a small, cost effective standard package resulting in significant performance, reliability, integration and cost benefits. The combining of a MEMS wafer with an industry standard CMOS wafer allows InvenSense to reduce the number of MEMS manufacturing steps, perform wafer-level testing, and use chip-scale packaging, thereby reducing back-end costs of packaging and testing and improving overall yield. The InvenSense approach is proven to address MEMS electrical interconnect issues, hermetically seals MEMS structures at the wafer level and enables standard low-cost semiconductor packaging and testing. The NF Platform has enabled the development of world class inertial sensors with the industry’s lowest noise performance, lowest power consumption, and smallest package size. Two leading semiconductor foundries, Global Foundries and TSMC, installed the InvenSense patented and proprietary fabrication platform on their 8” CMOS production lines.

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