2. Industry's first crystal device to apply atomic diffusion bonding techniqueThe atomic diffusion bonding technique is a direct bonding technique developed by Tohoku University's Professor Takehito Shimatsu. It entails bonding the wafer and substrate together without applying heat, pressure or voltage, nor using organic adhesives. Through the joint-development with Professor Shimatsu's research group, Kyocera Crystal Device has succeeded in bonding a crystal wafer in an extremely thin metal film thickness of several atomic layers to several dozen nanometers *2 with high strength by applying the atomic diffusion bonding technique for crystal devices. This method has solved the problems of optical contact *3, a conventional bonding method with lower bonding strength, and that of bonding using organic adhesive, for which the management of bonding thickness is difficult. It has also improved accuracy and reliability while reducing the size of the etalon filter.
KYOCERA Develops Temperature Characteristics-Free Etalon Filter
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