2. Industry's first crystal device to apply atomic diffusion bonding techniqueThe atomic diffusion bonding technique is a direct bonding technique developed by Tohoku University's Professor Takehito Shimatsu. It entails bonding the wafer and substrate together without applying heat, pressure or voltage, nor using organic adhesives. Through the joint-development with Professor Shimatsu's research group, Kyocera Crystal Device has succeeded in bonding a crystal wafer in an extremely thin metal film thickness of several atomic layers to several dozen nanometers *2 with high strength by applying the atomic diffusion bonding technique for crystal devices. This method has solved the problems of optical contact *3, a conventional bonding method with lower bonding strength, and that of bonding using organic adhesive, for which the management of bonding thickness is difficult. It has also improved accuracy and reliability while reducing the size of the etalon filter.
KYOCERA Develops Temperature Characteristics-Free Etalon Filter
Check Out Our Best Services for Investors
- $2.5+ million portfolio
- Large-cap and dividend focus
- Intraday trade alerts from Cramer
Access the tool that DOMINATES the Russell 2000 and the S&P 500.
- Buy, hold, or sell recommendations for over 4,300 stocks
- Unlimited research reports on your favorite stocks
- A custom stock screener
- Model portfolio
- Stocks trading below $10
- Intraday trade alerts
More than 30 investing pros with skin in the game give you actionable insight and investment ideas.