Leading measurement instrument supplier Advantest Corporation (TSE: 6857, NYSE: ATE) has introduced its new Multi- Vision Metrology Scanning Electron Microscope, the Wafer MVM-SEM E3310, which measures fine-pitch patterns on a wide range of wafer types with unparalleled accuracy, utilizing Advantest’s proprietary electron beam scanning technology.
WAFER MVM-SEM E3310 (Photo: Business Wire)
Built on advances in the technology used in Advantest’s E3630 MVM-SEM for photomasks, the E3310 achieves superior capabilities for scanning and measurement of wafers for next-generation devices. It is a stable, high-accuracy measurement solution for process development at the 1Xnm node and mass production at the 22nm node and beyond, contributing to reduced process TAT (turn around time) and higher productivity. The E3310 will be featured in Advantest’s exhibit (booth #3D-803 in Hall 3) at the SEMICON Japan trade show, December 5-7 in Makuhari Messe in the Chiba prefecture.
A Next-Generation 3D Measurement Solution
While advances in semiconductor technology have historically followed Moore’s Law, technical challenges have recently imperiled the transition to yet-smaller processes. The development of 3D transistor technologies such as FINFET (fin-based field effect transistors) is expected to bridge the gap to mass production at the 22nm node and subsequently the 1Xnm node. Advantest’s new E3310 provides a stable, highly accurate 3D measurement solution suitable for these next-generation needs.Product Features 3D Measurement The E3310’s multi-detector configuration allows it to achieve stable, highly accurate measurements at the 1Xnm node. It also features a proprietary detection algorithm, enabling measurement of the 3D FinFET architectures that are in the process of full-scale adoption by the semiconductor industry. Highly Stable, Fully Automatic Image Capture The E3310 performs stable, fully automatic measurements even at high SEM magnification, thanks to its high-accuracy stage, charge control function, and contamination reduction technology.