Kulicke & Soffa Industries, Inc. (NASDAQ:KLIC) ("K&S") today announced the appointment of Deepak Sood to the role of Vice President of Global Engineering, effective January 1, 2013. Mr. Sood will relocate from Fort Washington, Pennsylvania to the K&S Global Corporate Headquarters in Singapore. He will succeed Charles Salmons, Senior Vice President of Global Engineering, who will be leaving at the end of December 2012, after a long and successful 35 year career at K&S.
“I am very pleased that Deepak has accepted this new challenge, and confident that his extensive technology experience will allow us to maintain our technology leadership position,” said Bruno Guilmart, President and Chief Executive Officer. “We thank Charles for his dedication, accomplishments and leadership over the last three and a half decades.”
Mr. Sood brings with him 25 years of valuable engineering experience to his new position. After joining K&S in 1995, he held key positions in the Vision Systems and Electrical Engineering groups. In 2006, he was named Global Director of Software and Vision Systems, managing a geographically diverse and highly effective team. Prior to joining K&S, Mr. Sood was a Research Engineer at Lawrence Livermore National Labs in California.
“I am excited to take on the challenges of this new role during an important period at the Company,” said Mr Sood. “I look forward to continue the rich tradition of engineering excellence in K&S by leading our highly capable, world-class Engineering team to expand our innovative product offerings.”Mr. Sood received a Bachelor of Science degree in Electronics from Thapar Institute of Engineering. He later received a Master of Science degree in Electrical Engineering from Wright State University and earned his Ph.D in Electrical, Computer and Systems Engineering from Rensselaer Polytechnic Institute. About Kulicke & Soffa Kulicke & Soffa (KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding die and wedge bonders and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. ( www.kns.com)