, Oct. 19, 2012 /PRNewswire/ -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has qualified the foundry industry's first high voltage (HV) embedded flash (eFlash) process that incorporates a true 12-volt solution. This 12V process enables single chip integration with improved signal-to-noise ratio (SNR) for mid to large panel touch screen applications by combining the HV component that drives the sensor elements with the embedded flash memory that stores the control algorithm. Compared to industry HV offerings such as 18V, 24V or 32V, this 12V solution provides an excellent balance between SNR and power consumption.
Anchor Chen, senior director of UMC's Specialty Technology Development division, said, "UMC is committed to developing a technology portfolio that includes leading-edge as well as customer-driven specialty technologies to address a full spectrum of customer applications. Being the first to introduce a true 12V option that can be integrated to our A+ aluminum eFlash processes puts UMC in a favorable position to capitalize on the fast growing mid-to-large panel touch screen market. We look forward working with customers to help them take advantage of this technology."
This new 12V embedded flash offering builds upon UMC's existing success for 0.18um and 0.11um eFlash products to help accelerate customers' time-to-market and differentiate their products in the booming touch IC market. UMC has shipped hundreds of thousands of eFlash wafers and several IC design houses have already adopted and qualified UMC's 12V eFlash solution into their touch screen products.
UMC's true 12V eFlash technology is currently available in both 0.11um and 0.18um process generations. Please contact your UMC account manager or visit
for more information.
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in
-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in
the United States
. UMC can be found on the web at
Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information concerning these risks is included in UMC's filings with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.