David Chapman, VP of Marketing and Applications Engineering at
GSI Technology, Inc. (Nasdaq: GSIT),
today presented his vision for next generation memory technologies at the Linley Group’s Tech Processor Conference in San Jose.
“It’s no surprise to anyone that memory bottlenecks are driving line card designers absolutely crazy,” said Chapman. “We believe that our upcoming Type IVe SRAMs with 2.8B transactions/second capability will be the next step. But we’re convinced that a 2.5D High Transaction Rate Memory, tailored for the networking business, is a must-have for mainstream 400G designs. And we intend to be there.”
About GSI Technology
Founded in 1995, GSI Technology, Inc. is a provider of high performance semiconductor memory solutions to networking, industrial, medical, aerospace and military customers. The company is headquartered in Sunnyvale, California and has sales offices in the Americas, Europe and Asia. For more information, please visit
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