To address Yeldi Softcom's requirements for the ara eTap program, Identive developed a unique NFC payment tag based on its patent-pending tom® (tag on metal) smart inlay technology, which shields the tag's radio frequency signal from the metal in the mobile phone to allow a reliable, high-performance connection between the tag and phone. The tag is manufactured using an abrasion-resistant surface and unique printing process that offers unsurpassed protection and longevity when deployed on mobile phones in the field.
For the chip technology within the tag, Identive worked closely with its longstanding tag IC provider NXP Semiconductors, the co-inventor and market leader of NFC. "Yeldi´s new ara eTap is a major step forward for micro cashless payment in India and beyond. NXP, the leader in the global identification market, provides Identive and Yeldi with a complete payment solution based on our secure MIFARE DESFire platform and award winning PN65 mobile transaction IC. The MIFARE DESFire ICs for Identive´s Yeldi project are NFC tag type 4 compliant and already successfully used in the New Delhi, Bengaluru and Mumbai transport ticketing schemes," said Martin Gruber, general manager, MIFARE product line, NXP Semiconductors.
"Identive has made a significant investment in developing innovative NFC technology to support cashless payment applications such as ara eTap and we are pleased to support the launch of this ground-breaking program," said Dr. Manfred Mueller, COO of Identification Products for Identive.
At SmartCards Expo 2012 (NSIC Exhibition Ground, Okhla Industrial Estate, New Delhi, October 10-12) visitors can learn more about Yeldi's Mobile NFC Cashless Payment Solution at the NXP booth (#A1) as well as Identive's booth (#C1).
Identive Group, Inc. (Nasdaq:INVE) (Frankfurt:INV) is focused on building the world's signature company in Secure ID. The company's products, software, systems and services address the markets for identity management, physical and logical access control, cashless payment, NFC solutions and a host of RFID-enabled applications for customers in the government, enterprise, consumer, education and healthcare sectors. Identive's mission is to build a lasting business of scale and technology based on a combination of strong technology-driven organic growth and disciplined acquisitive expansion. The company delivers up-to-date information on its activity as well as industry trends through its industry-leading social media initiatives and educational resource, AskIdentive.com. For additional information, please visit
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About NXP Semiconductors
NXP Semiconductors N.V. (Nasdaq:NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing Expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting
Note: tom is a registered trademark of Identive Group, Inc. MIFARE and MIFARE DESFire are trademarks of NXP Semiconductors. All other trademarks are the property of their respective owners.
This document includes forward-looking statements which include statements regarding NXP Semiconductors' business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and our financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website,
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CONTACT: Identive Group
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