Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today announced its first Schottky diode to be offered in the miniature leadless DFN0603 package. Handling switching, reverse-blocking and rectification functions, the 30V, 0.1A-rated SDM02U30LP3 meets the higher density design requirements of ultra portables, including smart phones and tablets.
Measuring just 0.62mm x 0.32mm x 0.30mm, the DFN0603 packaged Schottky uses around 66% less board space than the industry-standard DFN1006 and SOD923 alternatives. Additionally, the DFN0603 has an off-board profile advantage over the DFN1006 and SOD923, as it is 25% thinner.
To ensure that power losses are minimized and portable battery lifetime is maximized, the SDM02U30LPS is characterized by a very low forward voltage of 0.37V and a maximum leakage current of only 7µA. For further information, visit the Company’s website at
About Diodes Incorporated
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor's SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. Diodes' products include diodes, rectifiers, transistors, MOSFETs, protection devices, functional specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors; power management devices, including LED drivers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. The Company's corporate headquarters, logistics center, and Americas' sales office are located in Plano, Texas. Design, marketing, and engineering centers are located in Plano; San Jose, California; Taipei, Taiwan; Manchester, England; and Neuhaus, Germany. The Company's wafer fabrication facilities are located in Kansas City, Missouri and Manchester, with two manufacturing facilities located in Shanghai, China, another in Neuhaus, and two joint venture facilities located in Chengdu, China. Additional engineering, sales, warehouse, and logistics offices are located in Fort Worth, Texas; Taipei; Hong Kong; Manchester; and Munich, Germany, with support offices located throughout the world. For further information, including SEC filings, visit the Company's website at