In addition to its new DDR3 SDRAMs, ISSI also offers a broad line of SDR, mobile SDR/DDR, DDR, and DDR2 products, as well as a comprehensive line of asynchronous and synchronous SRAMs with densities from 64Kb to 72Mb, flash memory products, and analog & mixed signal products. ISSI supports a range of Known Good Die (KGD) devices in its portfolio.
Samples of the x16, 1.5V DDR3 products, the IS43TR16128A and IS43TR16640A, are available in commercial and industrial temperature ranges, and the IS46TR16128A and IS46TR16640A are available in automotive temperature ranges with volume production shipments beginning in the first quarter of 2013. Samples of the x8, 1.5V options, and x8/x16, 1.35V options will be available near the end of the year with volume production shipments beginning in the first quarter of 2013.
ISSI is a fabless semiconductor company that designs and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) communications, (iii) industrial, medical, and military, and (iv) digital consumer. The Company's primary products are high speed and low power SRAM and low and medium density DRAM. With its acquisition of Chingis, ISSI designs and markets a variety of NOR flash memory technologies used in standalone and embedded applications. ISSI also designs and markets high performance analog and mixed signal integrated circuits. ISSI is headquartered in Silicon Valley with worldwide offices in Taiwan, Japan, Singapore, China, Europe, Hong Kong, India, and Korea. Visit our web site at
The Integrated Silicon Solution, Inc. logo is available at
Forward Looking Statements This news release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Statements concerning providing long lifecycle support, plans to offer devices, long-term commitment to product roadmap, driving adoption of memory technology and driving system designers to incorporate DDR3 DRAMs into their products are forward-looking statements that involve risks and uncertainties that could cause actual results to differ materially from those anticipated. Such risks and uncertainties include our ability to release new products on a timely basis and with the specifications and performance desired by our current and potential customers, our actual ability to support products on a long-term basis, industry and market developments, the actual adoption rates for memory technology, the actual demand for our products and the products of our current and potential customers which use our products and other risks listed from time to time in the Company's filings with the Securities and Exchange Commission, including the Company's Form 10-K for the year ended September 30, 2011 and its Form 10-Q for the quarter ended June 30, 2012.
CONTACT: Integrated Silicon Solution, Inc.
Ron Kalakuntla 408.969.4675
Tom Doczy 408.969.4620
Leanne K. Sievers 949.224.3874