Our ROIC has been under some pressure in the last couple of quarters, but it's still above our whack. It's about 9%, which is one of the higher ones in the space as well, and we do view that we are well positioned for future growth.
Net sales were about $2.8 billion. EBITDA was about $500 million, adjusted for legal settlement that we had in last quarter that goes up to $533 million, and net income also goes up to right about $100 million, when we adjust for that legal settlement.
Let's talk about the growth drivers that we see, so there is a couple of different areas that we are looking at. One is the end market, and specifically for us where we've seen a lot of growth is smartphones and tablets in the communication space. It's about 45% of the business now and it's been gaining share relative to some of the other end markets and we see that as continuing to grow.
We are deeply penetrated in the key devices in all the spaces that we look at and we do have really strong ties with both, our customers and with their customers, the OEMs where we work very closely with them on developing their roadmaps.There is also drivers with respect to technology, and for us the big driver technology-wise in the space, has been the migration out of build wire bond. There are two avenues for that. One is, migrating into flip chip, which is really our strength. We focus on advanced packaging more so than our other competitors. Right now about 45% of our business has migrated into flip chip and that's been very successful for us and very positive for our gross margins, and we've also developed some leading edge technology called fine pitch copper pillar, which enables much finer pitch and also cost reductions in the space. Three packaging is coming up in the next couple of years, and then there is copper wire bonding, which is the other migration out of gold wire bonding, and we are ramping that very rapidly this year. Read the rest of this transcript for free on seekingalpha.com