Amkor Technology, Inc. (AMKR)
Citi Technology Conference
September 06, 2012, 14:00 p.m. ET
Joanne Solomon - EVP and CFO
Bob Lanzone - SVP, Advanced Product Development
Greg Johnson - Head, Corporate Communications
It's a pleasure to have Amkor with us today. (Inaudible) semi cap equipment and also specialty semiconductor analyst and again welcome Amkor. Joanne Solomon, CFO will be presenting 20 minutes presentation we will also then have some Q&A and then turn it over for audience question. So, with that let's get started. Joanne.
Thank you, Caris, and thank you everyone for joining us today. With me today I have Bob Lanzone, he is our Senior Vice President in Advanced Product Development and Greg Johnson, Head of Corporate Communications. So, as you are attending a question feel free to ask any technology based questions, Bob will do a great job.
To get started I have two slides that I will walk you through and three slides will be counted disclaimer slides to the extent that we have any forward-looking information I'd just caution you that there is with respect to forward-looking information we refer to our SEC filings and I'll follow to it with respect to guidance is our last time giving guidance is as of July 26 their comments relating to the guidance as of that date.
To give some highlights of the business for people who may not be out familiar with the story. Amkor is one of the leading outsource semiconductor packaging and cap providers. So, we are a contract manufacturer, our manufacturing facilities are in Asia base about 75% of our revenues come out of (inaudible). And we have manufacturing locations in Taiwan as well as China and Japan. The industry is dominated by poor principle outsource of semi and test providers, ASC, OSAT. ASC has largely been up, we are larger than they are with respect to flip chip, assembly and test and then going without chip pack, which is core to Amkor and where we sustained our competitive advantage over the last 40 years. Our focus is largely on the advanced package development. So, we tend to bring new packages to their and then benefit from the higher market share initially and that’s where we are seeing today and flip chip as more and more packages migrate out of wire bound into flip chip. And we are well positioned to capitalize on that trend and we have the leading market share in support of flip chip.