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Thursday, September 6, 2012,
Vincent Tong, Xilinx senior vice president of worldwide quality and new product introductions, will deliver a keynote entitled, "The Evolution of 3D ICs: Leaping Ahead of Moore's Law to Deliver a 6.8B Transistor Device" and participate in an industry panel.
What: SEMICON Taiwan, 3D IC Technology Forum
Where: TWTC Nangang Exhibition Hall,
Taipei, TaiwanWhen: September 5-7, 2012
Given the growing importance of packaging and testing in the global semiconductor supply chain, SEMI is holding the SiP Global Summit under the auspices of SEMI's Taiwan Packaging and Testing Committee, as well as major international enterprises and research organizations. The two-day SiP Global Summit 2012 consists of two major forums: 3D IC Technology and Embedded Technology with representatives from 20 of the world's top-notch IT firms slated to share insights into the 3D IC, TSV, silicon interposer and embedded substrate technologies.
Last year, participants in 3D IC Technology Forum agreed that realization of 3D IC and high volume manufacturing were not questions of "if," but "when." This year's forum – "3D IC Supply Chain Readiness - Confirmation and Clarification" – will examine industrial readiness and maturity throughout the entire infrastructure. Representatives from leading companies (2.5D/3D IC supply chain, including EDA, foundry, OSAT, etc.) will deliver keynotes and participate in a panel at the conclusion of the session.