Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“K&S” or the “Company”) today announced the extension of its highly successful K&S
platform. The Company’s new wafer level stud bumper,
, is an upgraded platform that offers new capabilities and increased efficiency along with optional wire bond, copper & silver alloy bonding capabilities.
builds on Kulicke & Soffa’s rich history of technology and market leadership. It features the
advanced hardware and software controls and improved serviceability. The new
is the fastest wafer level stud bumper available on the market, with optimal low temperature gold stud bumping capabilities.
Nelson Wong, Kulicke & Soffa’s Vice President - Business Unit Management, remarked, “We continue to focus on research and development in order to bring customers exciting innovations with unparalleled performance, like our new
. Our latest offering is able to help customers access the advanced bonding technology and built-in upgrade capabilities for added flexibility.”
Customers can get a first glance at this technologically advanced machine’s cutting-edge features during the SEMICON Taiwan show from September 5-7, 2012 in Booth #780, Floor 4.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding die and wedge bonders and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (