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SUNNYVALE, Calif., Aug. 30, 2012 (GLOBE NEWSWIRE) --
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors, today introduced the
AOC2403 – the industry's first Molded Chip Scale Package (MCSP) in a tiny 0.97mm x 0.97mm x 0.3mm power package. Compared to existing Chip Scale Package (CSP) solutions, MCSP reduces package height by 50% and improves the mechanical robustness of the package by protecting the encapsulated die with a layer of molding compound. The significant performance improvements of the MCSP technology make it ideal for the latest ultra-portable applications such as smart phones, tablet PCs, UltraBooks and other mobile hand-held devices.
A photo accompanying this release is available at
MCSP can easily replace a standard CSP by offering the same footprint, pin-out, and pitch, with the benefits of a more rugged and ultra-thin package. The MCSP encapsulates AOS's low on-resistance MOSFET silicon in a Green (halogen-free) molding compound, which end result is to give it a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products.
"The Molded Chip Scale Package offers an innovative solution to ultra-slim designs while improving the package robustness compared to existing CSP solutions. The innovative package, along with the low on-resistance AOS MOSFET technology, provides designers of ultra-portable systems with a compelling new power management solution," said Peter Wilson, Director of Low Voltage MOSFETs at AOS.